Mid-end and backend process technology (WET/Integration/Metal deposition/Lithography engineer)

パワーデバイス

前工程プロセス開発

後工程プロセス開発

Job Description



SPS (Smart Power Stage) products are expected to see significant demand growth from 2025 to 2030, with a particular surge in demand for AI servers. These devices, especially embedded VPS such as PT (Power Tower Module) and VPS (Vertical Power Stage), require Mid-end processes such as Cu-RDL, backside metal, and ultra-thinning of Si, which also help differentiate from competitors.

Renesas is strengthening in-house manufacturing, and as part of this, we plan to develop technologies for these Mid-end processes, secure production capacity and shorten LT through in-house production. These in-house productions are also strongly requested by customers. Going forward, chiplet technology that maximizes performance while reducing manufacturing costs and shortening development periods will increasingly require Mid-end processes such as RDL and bumps.

This time, we are recruiting personnel who understand the structure and characteristics of power devices and can build optimal processes from Mid-end processes such as RDL and OPM to back-side processes and dicing, as we internalize embedded VPS. By acquiring personnel well-versed in Mid-end and backside processes, it becomes possible not only to develop internal processes but also to respond to issues in OSAT.

We are seeking process engineers in the following four areas:

 

【Roles and Responsibilities】

①WET process engineer

Promotion of WET process development for Mid-end and backend processes of new products
Technical responses and reporting based on WET process development
Support for manufacturing line startup and mass production transition
Promotion of product quality and yield improvement activities
Support for technology development of new materials and new manufacturing methods related to WET process
Support for cost reduction activities in traditional WET processes

②Integration engineer

Promoting process development for Mid-end and backend processing of new products
Technical responses and reporting based on process development
Support for manufacturing line startup and mass production transition
Promotion of product quality and yield improvement activities
Support for technology development of new materials and new manufacture development
Support for cost reduction activities in conventional processes

③Metal deposition engineer

Promotion of metal deposition process development for intermediate and backend processes of new products
Technical responses and reporting based on metal deposition process development
Support for manufacturing line startup and mass production transition
Promotion of product quality and yield improvement activities
Support for technology development of new materials and new manufacturing methods related to metal deposition process
Support for cost reduction activities in traditional metal deposition processes

④Lithography engineer

Promotion of lithography process development for Mid-end and backend processing of new products
Technical responses and reporting based on lithography process development
Support for manufacturing line startup and mass production transition
Promotion of product quality and yield improvement activities
Support for technology development of new materials and new manufacturing methods related to lithography
Support for cost reduction activities in traditional lithography-related processes


Qualifications



①WET process engineer

Required:

Over 2 years of experience in WET process development or mass production
Experience in developing or evaluating WET process-related materials
Experience in developing or evaluating WET process-related equipment
Degree in engineering (mechanical, materials, electronics, chemistry, etc.)

Preferred:

Basic knowledge of power devices
Knowledge of reliability testing evaluation
Practical experience in process improvement and quality control
Experience in complying with quality standards such as ISO/IATF

②Integration engineer

Required:

Over 2 years of experience in semiconductor integration development after metallization
Basic knowledge of power devices
Knowledge of reliability testing evaluation
Practical experience in process improvement and quality control
Degree in engineering (mechanical, materials, electronics, chemistry, etc.)

Preferred:

Experience in semiconductor package development
Development experience in wafer process technology startup
Experience in complying with quality standards such as ISO/IATF

③Metal deposition engineer

Required:

Over 2 years of experience in semiconductor metal deposition process development or mass production
Experience in developing or evaluating metal deposition-related materials
Experience in developing or evaluating metal deposition-related equipment
Degree in engineering (mechanical, materials, electronics, chemistry, etc.)

Preferred:

Basic knowledge of power devices
Knowledge of reliability testing evaluation
Practical experience in process improvement and quality control
Experience in complying with quality standards such as ISO/IATF

④Lithography engineer

Required:

Over 2 years of experience in semiconductor lithography technology development or mass production
Experience in developing or evaluating lithography-related materials
Experience in developing or evaluating lithography-related equipment
Degree in engineering (mechanical, materials, electronics, chemistry, etc.)

Preferred:

Basic knowledge of power devices
Knowledge of reliability testing evaluation
Practical experience in process improvement and quality control
Experience in complying with quality standards such as ISO/IATF


Additional Information



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