{"id":90986,"date":"2026-03-02T07:10:12","date_gmt":"2026-03-01T22:10:12","guid":{"rendered":"https:\/\/layla-hr.com\/semi\/90986\/"},"modified":"2026-03-02T07:10:12","modified_gmt":"2026-03-01T22:10:12","slug":"semiconductor-assembly-process-development-enginner-6","status":"publish","type":"post","link":"https:\/\/layla-hr.com\/semi\/90986\/","title":{"rendered":"Semiconductor Assembly Process Development Enginner"},"content":{"rendered":"","protected":false},"excerpt":{"rendered":"","protected":false},"author":2,"featured_media":0,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[79,70,76],"tags":[136],"area":[8],"income":[102,103,104],"checked_slug":[],"class_list":{"0":"post-90986","1":"post","2":"type-post","3":"status-publish","4":"format-standard","6":"category-catsub18","7":"category-catsub09","8":"category-catsub15","9":"tag-136","10":"area-area06","11":"income-income01","12":"income-income02","13":"income-income03","14":"entry_article"},"acf":{"company":"\u30eb\u30cd\u30b5\u30b9 \u30a8\u30ec\u30af\u30c8\u30ed\u30cb\u30af\u30b9\u682a\u5f0f\u4f1a\u793e","jobtitle01":"Semiconductor Assembly Process Development Enginner","jobtitle02":"","jobdescription01":"Job Description\n\n\n\n\u3010Background \/ Position Overview\u3011\nWe are actively advancing technological innovation in the semiconductor post\u2011process, with a focus on next\u2011generation packaging technologies such as Flip Chip and SiP.\nIn particular, the fields of AI, high\u2011performance computing (HPC), automotive, and IoT are rapidly increasing their demand for higher\u2011density, higher\u2011reliability, and high\u2011thermal\u2011dissipation package technologies. As a result, development activities for FCCSP (Flip Chip Chip Scale Package) and FCBGA are accelerating.\n\nAs semiconductor packages continue to require more complex structures and multifunctionality in the future, expanding our technical capabilities and strengthening our development organization will be essential. To support this growth, we are seeking engineers with experience in semiconductor post\u2011processing.\n\nThis role offers the opportunity to work on cutting\u2011edge technologies\u2014such as high\u2011density, high\u2011thermal\u2011dissipation packages for AI\/HPC and high\u2011reliability packages for automotive and IoT\u2014and contribute to the development of packaging technologies that underpin innovations shaping society, including AI and autonomous driving.\n\n\u3010Key Responsibilities\u3011\nYou will be responsible for technology development in the semiconductor post\u2011process, including assembly, packaging, and testing.\n\nDevelopment and evaluation of advanced package technologies such as FCLGA, FCCSP, and BGA\nProcess development and improvement of assembly processes (solder paste printing, component mounting, FC Bond, reflow process, flux cleaning process)\nSupport for production line start-up and mass production transition\nProcess quality and yield improvement activities\n\n\u00a0\n\n\n\nQualifications\n\n\n\n\u3010MUST\u3011\n\u30fbExperience in technology development of semiconductor post-process (assembly and packaging) (4 years or more)\n\u30fbExperience in SMT process technology development (more than 4 years)\n\u30fbPractical experience in process improvement, quality control, equipment introduction, etc.\n\u30fbTechnical degree (mechanical, materials, electronics, chemistry, etc.)\n\n\u3010WANT\u3011\n\u30fbExperience in process development and evaluation for FCPackage and high-density packages\n\u30fbExperience in developing AI\/HPC packages (high-reliability design)\n\u30fbExperience in reliability testing and standard compliance for automotive and IoT packages\n\u30fbExperience in meeting quality standards such as ISO\/IATF\n\n\n\nAdditional Information\n\n\n\n\u30eb\u30cd\u30b5\u30b9\u306f\u3001\u300cTo Make Our Lives Easier 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