{"id":90638,"date":"2026-02-25T06:56:45","date_gmt":"2026-02-24T21:56:45","guid":{"rendered":"https:\/\/layla-hr.com\/semi\/90638\/"},"modified":"2026-02-25T06:56:45","modified_gmt":"2026-02-24T21:56:45","slug":"semiconductor-assembly-process-development-enginner-3","status":"publish","type":"post","link":"https:\/\/layla-hr.com\/semi\/90638\/","title":{"rendered":"Semiconductor Assembly Process Development Enginner"},"content":{"rendered":"","protected":false},"excerpt":{"rendered":"","protected":false},"author":2,"featured_media":0,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[101,70,76],"tags":[136],"area":[46],"income":[102,103,104],"checked_slug":[],"class_list":{"0":"post-90638","1":"post","2":"type-post","3":"status-publish","4":"format-standard","6":"category-catsub40","7":"category-catsub09","8":"category-catsub15","9":"tag-136","10":"area-area44","11":"income-income01","12":"income-income02","13":"income-income03","14":"entry_article"},"acf":{"company":"\u30eb\u30cd\u30b5\u30b9 \u30a8\u30ec\u30af\u30c8\u30ed\u30cb\u30af\u30b9\u682a\u5f0f\u4f1a\u793e","jobtitle01":"Semiconductor Assembly Process Development Enginner","jobtitle02":"","jobdescription01":"Job Description\n\n\n\n\u3010Background \/ Position Overview\u3011\nWe are actively advancing technological innovation in the semiconductor post\u2011process, with a focus on next\u2011generation packaging technologies such as Flip Chip and SiP.\nIn particular, the fields of AI, high\u2011performance computing (HPC), automotive, and IoT are rapidly increasing their demand for higher\u2011density, higher\u2011reliability, and high\u2011thermal\u2011dissipation package technologies. As a result, development activities for FCCSP (Flip Chip Chip Scale Package) and FCBGA are accelerating.\n\nAs semiconductor packages continue to require more complex structures and multifunctionality in the future, expanding our technical capabilities and strengthening our development organization will be essential. To support this growth, we are seeking engineers with experience in semiconductor post\u2011processing.\n\nThis role offers the opportunity to work on cutting\u2011edge technologies\u2014such as high\u2011density, high\u2011thermal\u2011dissipation packages for AI\/HPC and high\u2011reliability packages for automotive and IoT\u2014and contribute to the development of packaging technologies that underpin innovations shaping society, including AI and autonomous driving.\n\n\u3010Key Responsibilities\u3011\nYou will be responsible for technology development in the semiconductor post\u2011process, including assembly, packaging, and testing.\n\nDevelopment and evaluation of advanced package technologies such as FCCSP and FCBGA\nProcess development and improvement for assembly processes\n(FC bonding, solder paste printing, component mounting, reflow, flux cleaning, etc.)\nSupport for production line launch and transition to mass production\nActivities to improve process quality and yield\n\n\nQualifications\n\n\n\n\u3010MUST\u3011\n\nMinimum 5 years of experience in semiconductor post\u2011process technology development (assembly and packaging)\nMinimum 5 years of experience in SMT process technology development\nExperience in process development and evaluation for Flip Chip packages (FCPackage) and other high\u2011density packages\nHands\u2011on experience in process improvement, quality control, and equipment introduction\nBachelor\u2019s degree or higher in a technical field (Mechanical Engineering, Materials Science, Electronics, Chemistry, etc.)\n\n\u3010WANT\u3011\n\nExperience in developing AI\/HPC packages, particularly in high\u2011reliability package design\nExperience in reliability testing and compliance with industry standards for automotive and IoT packages\nExperience working with quality standards such as ISO and IATF\n\n\nAdditional Information\n\n\n\n\u30eb\u30cd\u30b5\u30b9\u306f\u3001\u300cTo Make Our Lives Easier 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