エッチング装置

前工程プロセス開発

成膜装置

Summary

1. Lead new technology transfers, production line set up / maintenance, team establishment, quality / productivity improvement to ensure the whole production process smoothly.

2. Elevate Engineering and Manufacturing excellence in PVD/DIF/CVD/CMP/LIT/ETCH (either one) field.

 

Responsibilities

（Immediately after hiring)

1. Module process / equipment fundamental improvement.

2. Innovate and seize opportunities for wafer quality / productivity improvement.

3. Work with Process integration / Manufacturing / Yield improvement / Cross module team to sustain high quality wafer production / delivery.

4. Proactively identify talent and continuously develop team members with a deliberate roadmap.

5. Sustain ownership of day-to-day operations, equipment troubleshooting and mentoring engineers, Resources planning, task prioritization, and related cross-function management work. 

(Scope of change) There is a reassignment to the work specified by the Company.

 

Minimum Qualifications

Qualifications (Education, Skills, Certificates, etc.):

1. Minimum of a Bachler degree in an engineering and scientific field such as Materials Science, Electrical Engineering, Chemical Engineering and Mechanical Engineering, or equivalent work experiences and background.

2. Minimum 8 years of experience in the semiconductor field, especially in module process development, or equivalent work experiences and background.

3. Solid technical understanding of IC processing equipment, integrated flow, chemistry and physics.

4. Exhibit good and open communication skills; be able to work within cross-functional teams, including internal and external partners.

5. Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.

6. Flexibility to change priorities and responsibilities to support business needs.

7. Hands-on participant with a strong sense of ownership.

8. Willing to work in clean room.

  

Languages:

Japanese: Full Professional Proficiency or Native / Bilingual Proficiency

English:     Limited Working Proficiency or above

  

Key Experience:

Experience in the semiconductor industry PVD/DIF/CVD/CMP/LIT/ETCH (either one) with process and equipment knowledge.

  

Personal Attributes:

1. Must be willing to relocate to Taiwan for extended period for training

2. Must be a self-starter, highly organized, and able to work well across organizations.

3. Polished presentation and interpersonal skills.

4. Good in communication and negotiation.

5. Quick assimilator of new technology.

 

Preferred Qualifications

Experience with leading company of IDM in semiconductor industry is a huge plus.

 

Working Conditions

1. Location - （Immediately after hiring) 4106-1 Haramizu, Kikuyou-machi, Kikuchi-gun, Kumamoto, 869-1102 　(Scope of Change) Location determined by the Company

2. Working Days & Hours - 8:30～17:30

3. Benefits, Welfare - Health insurance, Employee pension, Employment insurance, Industrial accident compensation insurance, Pension plan, Retirement allowance plan, Annual leave, Commuting allowance: Actual expenses (maximum 50,000 yen/month), Housing allowance (In accordance with company's regulations)

4. Holiday - Saturdays, Sundays & Holidays, Vacation regulations：GW vacation, Year-end and New Year vacations　※Follows the vacation regulations according to the company calendar

5. Recruitment Process - 3-4 interviews → offer

※Interview process is subject to change